Prototype PCB Assembly
Prototype PCB Assembly
  • Capability of Through Hole, Large foot print parts assembly.
  • Capability of SMT & BGA Placement up to 35 SqMM
  • High Density between leads placement ability
  • BGA Rework, Wire wrapping, Crimping and tinning capabilities.
  • Our USP is to test the assembly functionally in our Lab before dispatch.
  • Test Fixture design and Fabrication.
  • Capability to manufacture custom metal parts fabrication at very economical cost.
  • Tel : +91 (80) 2524 4666, Fax : +91 (80) 2534 3194, email : contact@qualtech.in