Capability of Through Hole, Large foot print parts assembly.
Capability of SMT & BGA Placement up to 35 SqMM
High Density between leads placement ability
BGA Rework, Wire wrapping, Crimping and tinning capabilities.
Our USP is to test the assembly functionally in our Lab before dispatch.
Test Fixture design and Fabrication.
Capability to manufacture custom metal parts fabrication at very economical cost.